12-layer Through Holes PCB 1.6mm IT-180 Impedance Matt Red
1.Basic PCB Specifications
Board Type: 12 Layers
Material Type: IT-180A, FR-4 Tg 170°C
Solder Mask: Both sides, Matt Red
Silkscreen: Print Top side, White
Surface Finish: ENIG
Total Board Thickness: 1.6mm ± 10%
Board Size: 80.15mm x 76.6mm (1 PCS)
Minimum Hole Size: 0.2mm
Solder Mask Thickness: 10µm
Minimum Dielectric Thickness: 100µm
Minimum Trace Line Width: 120µm
Minimum Spacing: 125µm
Plated Through Holes: L1-L12
Blind Vias: No
Impedance Control:
50 Ohm Differential Pairs Top layer, 4mil/4mil trace/gap, Reference layer 2
90 Ohm Differential Pairs Top layer, 5mil/6mil trace/gap, Reference layer 2
100 Ohm Differential Pairs Top layer, 6mil/9mil trace/gap, Reference layer 2
50 Ohm Differential Pairs Layer 3, 5mil/5mil trace/gap, Reference layers 2 & 4
90 Ohm Differential Pairs Layer 5, 7mil/6mil trace/gap, Reference layers 4 & 6
100 Ohm Differential Pairs Layer 8, 6mil/6mil trace/gap, Reference layers 7 & 9
All 0.2mm and 0.3mm vias are filled and capped according to IPC 4761 Type VII. Printing series number is required.
2.PCB Stack-up (Component Side at Top)
| TYPE |
LAYER NO. |
THICKNESS (um) |
SPECIFICATION |
| COPPER |
1 |
45 |
18um BASE COPPER + 25um PLATING |
| FR-4 |
PP |
150 |
IPC-4101/24 |
| COPPER |
2 |
17 |
|
| FR-4 IT-180 |
Core |
135 |
IPC-4101/24 |
| COPPER |
3 |
17 |
|
| FR-4 |
PP |
153 |
IPC-4101/24 |
| COPPER |
4 |
17 |
|
| FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
| COPPER |
5 |
17 |
|
| FR-4 |
PP |
94 |
IPC-4101/24 |
| COPPER |
6 |
17 |
|
| FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
| COPPER |
7 |
17 |
|
| FR-4 |
PP |
94 |
IPC-4101/24 |
| COPPER |
8 |
17 |
|
| FR-4 IT-180 |
Core |
115 |
IPC-4101/24 |
| COPPER |
9 |
17 |
|
| FR-4 |
PP |
150 |
IPC-4101/24 |
| COPPER |
10 |
17 |
|
| FR-4 IT-180 |
Core |
135 |
IPC-4101/24 |
| COPPER |
11 |
17 |
|
| FR-4 |
PP |
150 |
IPC-4101/24 |
| COPPER |
12 |
45 |
18um BASE COPPER + 25um PLATING |
3. PCB Statistics:
Components: 240
Total Pads: 482
Thru Hole Pads: 234
Top SMT Pads: 138
Bottom SMT Pads: 110
Vias: 256
Nets: 10
4.Artwork and Quality
Type of Artwork Supplied: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
5. Introduction to IT-180ATC
IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy, known for its high thermal reliability and CAF resistance. It is suitable for various applications and can withstand up to 260°C during lead-free assembly.
6. Features of IT-180ATC
Dielectric Constant (DK) 4.1 at 10GHz
Dissipation Factor 0.017 at 10GHz
Thermal Resistance T260 > 60 minutes, T288 > 20 minutes
Peel Strength (Min.) Standard ED Copper, 8 lbs/inch
CTE Matching to Copper X axis 11-13 ppm/°C, Y axis 13-15 ppm/°C
Low Z-Axis Coefficient of Thermal Expansion 45 ppm/°C
Tg > 175°C
Low Moisture Absorption 0.1%
UL 94-V0 Flammability Rating
7. Typical Applications
Automotive Engine Room ECU
Backplane
Data Storage
Server and Networking
Telecommunication
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